for Kingston Technology HyperX 8 GB (2x4 GB Modules) 1600 MHz DDR3 Dual Channel Kit KHX1600C9D3K2/8GX:




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for harga ram:






KHX1600C9D3K2/8GX OUT OF STOCK satu paket berisi 4Gb 2keping



Include ongkir P.JAWA



bisa NEGO asal WAJAR

for Kingston's KHX1600C9D3K2/8GX DESCRIPTION:






Kingston's KHX1600C9D3K2/8GX is a kit of two 512M x 64-bit (4GB) DDR3-1600 CL9 SDRAM (Synchronous DRAM) 2Rx8 memory modules, based on sixteen 256M x 8-bit DDR3 FBGA components per module. Each module kit supports Intel� XMP (Extreme Memory Profiles).



Total kit capacity is 8GB. Each module kit has been tested to run at DDR3-1600 at a low latency timing of 9-9-9-27 at 1.65V. The SPDs are programmed to JEDEC standard latency DDR3-1333 timing of 9-9-9 at 1.5V. Each 240-pin DIMM uses gold contact fingers and requires +1.5V. The JEDEC standard electrical and mechanical specifications are as follows:

for Kingston's KHX1600C9D3K2/8GX SPECIFICATIONS:






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for Kingston's KHX1600C9D3K2/8GX Feature:






� JEDEC standard 1.5V (1.425V ~ 1.575V) Power Supply

� VDDQ = 1.5V (1.425V ~ 1.575V)

� 667MHz fCK for 1333Mb/sec/pin

� 8 independent internal bank

� Programmable CAS Latency: 9, 8, 7, 6

� Posted CAS

� Programmable Additive Latency: 0, CL - 2, or CL - 1 clock

� Programmable CAS Write Latency(CWL) = 7 (DDR3-1333)

� 8-bit pre-fetch

� Burst Length: 8 (Interleave without any limit, sequential with

starting address �000� only), 4 with tCCD = 4 which does not

allow seamless read or write [either on the fly using A12 or

MRS]

� Bi-directional Differential Data Strobe

� Internal(self) calibration : Internal self calibration through ZQ

pin (RZQ : 240 ohm � 1%)

� On Die Termination using ODT pin

� Average Refresh Period 7.8us at lower than TCASE 85�C,

3.9us at 85�C < TCASE < 95�C

� Asynchronous Reset

� PCB : Height 1.180� (30.00mm), double sided component











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beli borongan dapet harga special

for testi:





[/quote][quote]






Originally Posted by Samasekali
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BENER-BENER GILA GAN SUSAH BUKA PAKING KAYUNYA....



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